TFSP-840ed2

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Latest design in Magnetron Sputtering Deposition System. Tailored for R&D and pilot production.

 SPUTTERING SYSTEM TFSP-840

Latest design in Magnetron Sputtering Deposition System 
Tailored for R&D and pilot production
Fully adaptable to a wide range of thin film processes
Range of optional devices including magnetrons size, power supplies, plasma sputtering and more
Features:

  • Compact construction, small footprint
  • Fully Automatic Control of Sputtering Film Grow
  • Gas injection with proprietary design to protect target contamination / poisoning in reactive sputtering
  • Substrate size up to 6”
  • Confocal setup
  • Independent gas inlets for each target / substrate
  • Co-sputtering mixing DC / DC-pulsed / RF / Bias
  • UV cleaning / surface activation
  • Post deposition oxidation
  • Annealing / degassing capability in load lock
  • Manual semi-automated load lock
  • Fully automated load lock
  • Human Machine Interface software
  • Process recipes builder with PC backup and Windows features
  • Historical data records of the sputtering process

Optional adds:

  • Substrate load lock for fast pump down cycle
  • Ion source Gridded (Etching) or Griddles (Cleaning)
  • Quartz crystal rate/thickness monitor
  • Motorized height (Z-shift) of sample holder
  • Substrate indexing stage parallel planar deposition
  • Substrate heating/cooling

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